This specification describes the requirements for a wafer prober system to be used for post-silicon verification, characterization and functional test of integrated circuits and chiplets at Fraunhofer EMFT. The wafer prober system must be able to handle 200mm and 300mm wafers and in addition wafers mounted on a dicing frame (frame prober function). This allows a very flexible usage for different analysis and test situations. The wafer prober will be coupled with an automated test system (ATE). With Option 1: an extended warranty contract Option 2: a service contract Option 3: maintanance support contract