Beschreibung
Modular, fully automated prober for optical inspection and electrical contact of electronic, photonic and mi-cro‑mechanical devices — including advanced manufacturing approaches such as quasi‑monolithic integration. The system handles 200 mm wafers as well as frames, tapes, trays and comparable substrates. An end‑to‑end carrier handling system loads carriers with mounted substrates from specialized cassettes, positions them on the prober's vacuum chuck and performs fully automated alignment. A testcard/probe‑card interface is provided for electrical connection. Probe detection and fine positioning are performed automatically to ensure reproducible contact conditions. The control software supports program-mable sequence control and reference‑point based alignment. For optical inspection the system offers a movable mechanical interface to accept modular, customer‑supplied optical inspection modules (e.g., microscope with camera) with lateral and vertical adjustment. The space above the probe platen (platen area) must remain completely clear during measurements; this is necessary to allow customer analysis hardware to be installed, aligned and operated without restriction and to prevent prober‑internal assemblies from obstructing access, line‑of‑sight or mounting of customer equipment.